Design Work

Thermal and hardware design.

Selected Work

Direct-to-chip cooling concept built in Siemens NX around a copper pedestal, dense micro-fin field, and transparent manifold.

Simcenter thermal study evaluating serpentine-slot isolation under applied heat load.

Multiphysics model used to estimate magnesium evaporation under plasma exposure when direct measurement is limited.

Active builds and engineering studies currently being refined, validated, and prepared for publication.