Siemens NX · Thermal Engineering · C101 Copper

High-Flux Liquid Cooling

A cold plate architecture study comparing two design paths: a compact microchannel plate optimized for low pressure drop, and a jet impingement extension for localized hotspot cooling.

50 × 50 mm fin field

Two design paths

Early Siemens NX concept render of transparent manifold micro-fin cold plate

Design paths

Each design is shown as its own engineering package: concept, flow path, CAD preview slot, specifications, and simulation plan. This avoids mixing the old render archive with the new design direction.

Design A · Microchannel / Low ΔP Current build path

Compact Diffuser Microchannel Cold Plate

The manufacturable baseline. Compact inlet and outlet plenums distribute flow into a dense micro-fin field without unnecessary dead volume, replacing the earlier oversized manifold-bath geometry.

Side inlet→ Compact diffuser / inlet plenum→ 50 × 50 mm micro-fin field→ Outlet collector→ Side outlet

Design preview slot

Compact Diffuser Microchannel

Reserved for the updated NX render once the compact diffuser, bolt layout, and 50 × 50 mm fin field are finalized.

Design A Specifications

Footprint	120 × 100 mm target
Active area	50 × 50 mm fin field
Inlet / outlet	Side-entry, side-exit
Plenums	5–8 mm compact diffuser / collector
Priority	Low ΔP, uniform flow
Revision	Bath manifold removed

Thermal study

Base temperature distribution, junction-adjacent ΔT, and heat spreading across the 50 × 50 mm micro-fin region.

Flow / ΔP analysis

Pressure drop, velocity uniformity, and channel-to-channel maldistribution through the compact diffuser layout.

Material: C101 Copper· Platform: Siemens NX· Status: Geometry revision in progress

Design B · Jet Impingement / Hotspot Advanced extension

Jet Impingement Cold Plate with Pin-Fin Target Zone

The high-performance hotspot design. Direct jet stagnation over a pin-fin target zone increases local heat transfer at the chip center, accepting higher pressure drop and manufacturing complexity as tradeoffs.

Top inlet plenum→ Nozzle array→ 2 mm standoff gap→ Pin-fin target zone→ Bilateral collector outlets

Design preview slot

Jet Impingement + Pin-Fin

Reserved for the updated NX render once the jet plenum, nozzle plate, standoff gap, and collector exits are finalized.

Design B Specifications

Architecture	Top-fed jet impingement
Jet layer	Nozzle plate + standoff gap
Standoff	2 mm above pin fins
Target zone	Pin fins aligned to heat source
Flow exit	Bilateral or perimeter collector
Priority	Hotspot suppression, high HTC

Hotspot thermal study

Local temperature reduction and heat-transfer enhancement under direct jet impingement at the chip-center region.

Jet flow analysis

Jet velocity profiles, stagnation zones, outlet balance, and pressure-drop tradeoffs through the nozzle array.

Material: C101 Copper· Platform: Siemens NX· Status: Nozzle plate geometry in progress

Architecture comparison

Decision Matrix Rev 02

Design A

Microchannel / Low ΔP

Compact diffuser with side inlet/outlet routing for lower pressure drop and more manufacturable flow distribution.

Best forPump-limited loops

Cooling modeDistributed

Pressure dropLower

ManufacturingStandard

Design B

Jet Impingement / Hotspot

Top-fed nozzle array with standoff gap and pin-fin target zone for concentrated high-flux hotspot control.

Best forChip-center hotspots

Cooling modeLocalized

Pressure dropHigher

ManufacturingComplex

These renders document the earlier transparent manifold-bath geometry. They are no longer the active build direction, but are kept to show the design evolution that led to the compact diffuser and jet impingement paths.